NO	TEST ITEM	TEST CONDITIONS	DURATION	REFERENCED DOCUMENT
1	SOLDER ABILITY	230° ±5°C	5 SEC	MIL-STD-202 METHOD 208
2	LEAD PULL	2KG IN AXIAL LEAD DIRECTION	10 SEC	MIL-STD-750 METHOD-2036
3	LEAD FATIGUE	90-DEGREE BEND WITH 0.5KG WEIGHT ATTACHED TO LEAD	3 TIMES	MIL-STD-750 METHOD-2036
4	OPERATING LIFE	RATED CURRENT @55°C RATED VOLTAGE	168/1000 HRS	MIL-STD-750C METHOD 1027
5	HIGH TEMPERATURE REVERSE BIAS	80% RATED VOLTAGE 125°C FOR STD TYPE 150°C FOR GPP TYPE	168/1000 HRS	MIL-STD-750 METHOD 1038
6	INTERMITTNET OPERATING LIFE	ON:5MIN WITH RATED IRMSPOWER OFF:5MIN WITH COOL FORCED     AIR	1000 CYCLES	MIL-STD-750 METHOD-1036
7	FORWARD SURGE CURRENT	8.3ms SINGLE HALF SINE-WAVE SUPERIMPOSED ON RATED LOAD	1 PULSE	MIL-STD-750 METHOD 4066
8	HIGH TEMPERATURE STORAGE LIFE	TSTG(max)	168/1000 HRS	MIL-STD-750 METHOD 1031
9	LOW TEMPERATURE STORAGE LIFE	TSTG(min)	168/1000 HRS	IEC-68-2-1 TEST A COLD
10	MOISTURE RESISTANCE	85°C，85%RELATIVE HUMIDITY	168/1000 HRS	MIL-STD-750 METHOD 1021
11	PRESSURE COOKER	15PSIG,121°C	4 HRS	MIL-S-19500 APPENDIX C
12	THERMAL SHOCK	0°C/5 MIN,100°C/5 MIN	10 CYCLES	MIL-STD-750 METHOD 1056
13	TEMPERATURE CYCLING	TSTG(max)/15 MIN TSTG(min)/15 MIN 25°C/5 MIN FOR TRANSFER	10 CYCLES	MIL-STD-750 METHOD 1051
14	SOLDERING HEAT	260°C +5°C -0°C	10SEC	MIL-STD-750 METHOD 2031

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